Temperature
Revision as of 10:54, 8 July 2016 by \('"2\)'"7
Overview
Commonly, the temperature \(\tau\) of a tile assembly system specifies the minimum strength with which glues must bind. For example, if in a tile assembly system \(\tau = 2\), then only tiles which have glues of strength \(2\) or greater on their adjacent edges may bind. While this is certainly true for the Abstract Tile Assembly Model (aTAM), Two-Handed Assembly Model (2HAM) and their derivatives, it certainly is not always the case. Consider the Kinetic Tile Assembly Model (kTAM). In this model errors are allowed to happen so that tiles bind with less than \(\tau\) strength.
In the paper by Hendricks, Patitz, and Rogers [1], it is shown that higher temperatures do not strictly add power to a tile assembly system.
References
- ↑
Jacob Hendricks, Matthew Patitz,, Trent Rogers - The Simulation Powers and Limitations of Higher Temperature Hierarchical Self-Assembly Systems
